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Advanced system-in-package implementation including die/BGA interface optimization
Concurrent die/package planning and route optimization
最大化功能密度和性能,最小化功耗
Complete IC packaging design and analysis solution for advanced fan-out wafer-level chip-scale package
强大的物理封装实现
Accelerating PDN designs
加速PCB和IC封装设计的信号完整性分析